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Intel
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5AGXFB7H4F35I3N

Manufacturer Part Number:
5AGXFB7H4F35I3N
Manufacturer / Brand
Intel
Part of Description:
IC FPGA 544 I/O 1152FBGA
Datasheets:
5AGXFB7H4F35I3N(1).pdf5AGXFB7H4F35I3N(2).pdf5AGXFB7H4F35I3N(3).pdf5AGXFB7H4F35I3N(4).pdf5AGXFB7H4F35I3N(5).pdf5AGXFB7H4F35I3N(6).pdf5AGXFB7H4F35I3N(7).pdf5AGXFB7H4F35I3N(8).pdf5AGXFB7H4F35I3N(9).pdf5AGXFB7H4F35I3N(10).pdf5AGXFB7H4F35I3N(11).pdf5AGXFB7H4F35I3N(12).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

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Part Number 5AGXFB7H4F35I3N
Manufacturer / Brand Intel
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 544 I/O 1152FBGA
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply 1.12V ~ 1.18V
Total RAM Bits 27695104
Supplier Device Package 1152-FBGA (35x35)
Series Arria V GX
Package / Case 1152-BBGA, FCBGA Exposed Pad
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 504000
Number of LABs/CLBs 23780
Number of I/O 544
Mounting Type Surface Mount
Base Product Number 5AGXFB7

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



5AGXFB7H4F35I3N Product Details:

Title: Understanding the 5AGXFB7H4F35I3N Integrated Circuit - Features, Applications, and Manufacturing Process Are you looking for a high-performance integrated circuit for your electronic device or industry? Look no further than the 5AGXFB7H4F35I3N! This field-programmable gate array (FPGA) is the go-to option for those in need of reliable and efficient electronic components. Featuring 544 input/output (I/O) pins and 1152 fine-pitch ball grid array (FBGA) package, the 5AGXFB7H4F35I3N has a wide range of features and applications. It is suitable for electronic devices, such as computer networks, communication systems, industrial control, and medical equipment, among others. This FPGA has high accuracy, ensuring output voltage, current, and power is within the desired range. It has an operating temperature range of -40°C to 100°C, making it ideal for use in harsh environments. Additionally, its high efficiency ensures optimal performance, making it a must-have for demanding applications. The 5AGXFB7H4F35I3N is an example of a Digital Integrated Circuit, which can be customized and configured by the customer. It has a mix of digital and analog capabilities, making it ideal for use in mixed signal circuits. The RF (Radio Frequency) capability allows it to be used in various wireless applications. The manufacturing process of the 5AGXFB7H4F35I3N is a complex one, requiring precise design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. This process ensures that the chip is of the highest quality and functionality. After manufacturing, the finished product undergoes testing and packaging to ensure maximum component quality. In conclusion, the 5AGXFB7H4F35I3N has the features, performance parameters, and versatility required for the most demanding applications in various industries. Its high efficiency, accuracy, and wide temperature range make it reliable in any environment. Its usage and application scenarios are vast and varied, and its complex manufacturing process ensures optimal quality. If you're looking for efficient and reliable electronic components, choose the 5AGXFB7H4F35I3N.

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